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IPC 2225 PDF
Original price was: $131.00.$79.00Current price is: $79.00.
Sectional Design Standard for Organic Multichip Modules (MCML & MCM-L Assemblies)
| Published by | Publication Date | Number of Pages |
| IPC | 05/01/1998 | 44 |
IPC 2225 – Sectional Design Standard for Organic Multichip Modules (MCML & MCM-L Assemblies)
This standard establishes the requirements and other considerations (thermal, electrical, electromechanical and mechanical) for the design of Single Chip Module (SCM-L), MCM or MCM-L assemblies. Key concepts include adhesive interconnection information, typical die attach materials, microvia material properties, relationships with DFM and DFE.
| Published | 05/01/1998 |
|---|---|
| ANSI | ANSI Approved |
| Number of Pages | 44 |
| File Size | 1 file , 590 KB |
| Product Code(s) | 2225(D)1 |
| Note | This product is unavailable in Russia, Ukraine, Belarus |
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