IPC J-STD-075 PDF

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Classification of Non-IC Electronic Components for Assembly Processes

Published by Publication Date Number of Pages
IPC 08/01/2008 20

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IPC J-STD-075 – Classification of Non-IC Electronic Components for Assembly Processes

J-STD-075 picks up where J-STD-020 left off by providing test methods to classify worst-case thermal process limitations for electronic components. Classification is referenced to common industry wave and reflow solder profiles including lead-free processing. The classifications represent maximum process sensitivity levels and do not establish rework conditions or recommended processes for an assembler. It outlines a process to classify and label non-semiconductor electronic component’s Process Sensitivity Level (PSL) and Moisture Sensitivity Level (MSL) consistent with the semiconductor industry’s classification levels (J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Devices and J-STD-033, Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices). This standard supersedes IPC-9503. Developed by ECA, IPC and JEDEC.

Edition

1st

Published

08/01/2008

Number of Pages

20

File Size

1 file , 390 KB

Note

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IPC J-STD-075 PDF
$93.00 Original price was: $93.00.$56.00Current price is: $56.00.