IPC J-STD-033D PDF
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Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices
| Published by | Publication Date | Number of Pages |
| IPC | 03/01/2018 | 32 |
IPC J-STD-033D – Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices
IPC/JEDEC J-STD-033D provides surface mount device manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive components. These methods help avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation and damaged components. IPC/JEDEC J-STD-033D procedures provide a minimum shelf life of 12 months from the seal date when properly implemented. Developed by IPC and JEDEC.
| Published | 03/01/2018 |
|---|---|
| Number of Pages | 32 |
| File Size | 1 file , 2.4 MB |
| Product Code(s) | J033-STD-0-D-0-EN-D, J033-STD-0-D-0-EN-D |
| Note | This product is unavailable in Russia, Ukraine, Belarus |
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