IPC J-STD-027 PDF

Original price was: $93.00.Current price is: $56.00.

Mechanical Outline Standard for Flip Chip or Chip Scale Configurations

Published by Publication Date Number of Pages
IPC 02/01/2003 20

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IPC J-STD-027 – Mechanical Outline Standard for Flip Chip or Chip Scale Configurations

THis standard establishes mechanical outline requirements for devices supplied in flip chip or CHip Size Package (CSP) formats. including die surface, die terminals, and interconnection balls/bumps/lands to the next level.

Published

02/01/2003

Number of Pages

20

File Size

1 file , 90 KB

Product Code(s)

J-027(D)1, J-027(D)1

Note

This product is unavailable in Russia, Ukraine, Belarus

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IPC J-STD-027 PDF
$93.00 Original price was: $93.00.$56.00Current price is: $56.00.