IPC J-STD-026 PDF

Original price was: $113.00.Current price is: $68.00.

Semiconductor Design Standard for Flip Chip Applications

Published by Publication Date Number of Pages
IPC 04/01/1999 48

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IPC J-STD-026 – Semiconductor Design Standard for Flip Chip Applications

This new standard addresses semiconductor flip chip design requirements. Provides information intended for applications utilizing standard semiconductor substrates, materials, assembly and test methods commensurate with established fabrication, bumping, test and handling practices. Covered in the standard are electrical, thermal and mechanical chip design parameters and methodologies, as well as the reliability aspects associated with these conditions and processes. The information applies to all new designs as well as modifications of non-flip chip designs

Published

04/01/1999

Number of Pages

48

File Size

1 file , 500 KB

Product Code(s)

J-026(D)1

Note

This product is unavailable in Russia, Ukraine, Belarus

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IPC J-STD-026 PDF
$113.00 Original price was: $113.00.$68.00Current price is: $68.00.