IPC DD-135 PDF
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Qualification for Deposited Organic Interlayer Dielectric Materials for Multichip Modules
| Published by | Publication Date | Number of Pages |
| IPC | 08/01/1995 | 36 |
IPC DD-135 – Qualification for Deposited Organic Interlayer Dielectric Materials for Multichip Modules
This standard has been written for deposited organic interlayer dielectric materials under evaluation for MCM-D applications. The standard and test methods have been written without bias towards any particular class of materials.
| Published | 08/01/1995 |
|---|---|
| Number of Pages | 36 |
| File Size | 1 file , 370 KB |
| Product Code(s) | DD-135(D)1 |
| Note | This product is unavailable in Russia, Ukraine, Belarus |
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