IPC 9707 PDF
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Spherical Bend Test Method for Characterization of Board Level Interconnects
| Published by | Publication Date | Number of Pages |
| IPC | 09/01/2011 | 24 |
IPC 9707 – Spherical Bend Test Method for Characterization of Board Level Interconnects
This standard on spherical transient bend testing is intended to characterize the maximum allowable strain that a surface mount component’s board level interconnects can withstand in flexural loading. Whereas four-point monotonic bend test methods only address simple planar bending, spherical bend tests establish strain limits of board level interconnects under worst-case flexure conditions that can occur during conventional printed board/system assembly, manufacturing and test operations. This method is applicable to surface mounted BGA components larger than 15.0 mm on a side with organically based substrates, attached to printed boards using conventional solder reflow technologies. This document was developed cooperatively with JEDEC.
| Published | 09/01/2011 |
|---|---|
| Number of Pages | 24 |
| File Size | 1 file , 2.4 MB |
| Note | This product is unavailable in Russia, Ukraine, Belarus |
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