IPC 9502 PDF
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PWB Assembly Soldering Process Guideline for Electronic Components
| Published by | Publication Date | Number of Pages |
| IPC | 04/01/1999 | 12 |
IPC 9502 – PWB Assembly Soldering Process Guideline for Electronic Components
This document describes manufacturing solder process limits that components subjected to IPC-9501, IPC-9504 and J-STD-020 would survive. It does not include optimum conditions for assembly, but rather guides to assure components are not damaged. This document applies to both surface-mount (SM) and through-hole (TH) components that are wave soldered, reflowed or hand soldered. This document is intended to complement other industry documents. Note: This document does not address the increased temperature requirements of lead-free solders.
| Published | 04/01/1999 |
|---|---|
| Number of Pages | 12 |
| File Size | 1 file , 210 KB |
| Part of | IPC M109, IPC 9500-K |
| Product Code(s) | 9502(D)1 |
| Note | This product is unavailable in Russia, Ukraine, Belarus |
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