IPC 7091 PDF

Original price was: $168.00.Current price is: $101.00.

Design and Assembly Process Implementation of 3D Components

Published by Publication Date Number of Pages
IPC 06/01/2017 108

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IPC 7091 – Design and Assembly Process Implementation of 3D Components

The IPC-7091 intends to provide useful and practical information to those who are designing, developing or using 3D-packaged semiconductor components or those who are considering 3D package implementation. The 3D semiconductor package may include multiple die elements?some homogeneous and some heterogeneous. The package may also include several discrete passive SMT devices, some of which are surface mounted and some of which are integrated (embedded) within the components? substrate structure.

Published

06/01/2017

Number of Pages

108

File Size

1 file , 5.3 MB

Product Code(s)

7091-STD-0-P-0-EN-0, 7091-STD-0-P-0-EN-0

Note

This product is unavailable in Russia, Ukraine, Belarus

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IPC 7091 PDF
$168.00 Original price was: $168.00.$101.00Current price is: $101.00.