IPC 9701B PDF
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Thermal Cycling Test Method for Fatigue Life Characterization of Surface Mount Attachments
| Published by | Publication Date | Number of Pages |
| IPC | 02/01/2022 | 24 |
IPC 9701B – Thermal Cycling Test Method for Fatigue Life Characterization of Surface Mount Attachments
This specification establishes a thermal cycling test method to characterize the fatigue lifetimes of surface mount solder attachments of electronic assemblies. The surface mount devices may be solder-attached to rigid, flexible or rigid-flex printed boards. The characterization results can be used to predict field lifetime of solder attachments for the use environments and conditions of electronic assemblies.
| Published | 02/01/2022 |
|---|---|
| ISBN(s) | 9781638160724 |
| Number of Pages | 24 |
| File Size | 1 file , 1 MB |
| Product Code(s) | 9701-STD-0-D-0-EN-B, 9701-STD-0-D-0-EN-B |
| Note | This product is unavailable in Russia, Ukraine, Belarus |
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